Heat sinks(Metal-backed PCB)

                                        Production since 2003

                                        Hybrid or Teflon PCB’s

                                        Bonded to thick Copper pallets ( 1mm – 5mm)

                                        Large WPNL size

                                        Experience with Pre-bonded, Post-bonded, Press fit, embedded and various coin designs

                                        Coin assembly by Bonding film, PSA , Embedded coin & Press fit

                                        Special team to support NPI and production

                                        Special team to support NPI and production

                                        Used in Power amplifiers or RF modules

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