HDI(Higth Density Interconnec)

                                        HDI = High Density Interconnect (Micro via)

                                        Layer count –up to 34 L

                                        Maximum thickness – 200mils (5.0mm)

                                        Max panel size 24X36”(612X916mm)

                                        Laser hole size : 3.9 ~ 16mil

                                        Various structure types:

                                        1+N+1

                                        2+N+2

                                        3+N+3

                                        Various via types:

                                        Staggered , Skip Vias 1-4, Stacked

                                        Via-in-pad designs

                                        Epoxy filled

                                        Via filling

                                        Plated over filled via (POFV/VIPPO)

                                        Conformal, large window , DLD Process

                                        Currently 14 Gauss +2 Top-hat CO2 laser drills

                                        Used in hi-speed line cards

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