Server Products

                                        Layer count – up to 34 L

                                        Maximum thickness – 200mils (5 mm)

                                        Max panel size 24”x 36” (612 x 916mm)

                                        Various board types:

                                        Back panel , Line card, POFV,

                                        Material Hybrid Technology

                                        0.94mm Pitch+2Track+Backdrill

                                        Gold finger and Segmented Gold finger

                                        Impedance Control, SI, Skip via, Low loss solder mask and Back drilling

                                        Dual connector and Smaller press fit hole size (0.32 mm)

                                        Set2dil, Delta L 4.0, VNA measurement capabilities

                                        0.5mm pitch BGA

                                        Used for Entry level Server, Blade Server, Rack Server, Hyperscale Server & High performance computing