LC(Line Card)

                                        Up to 40 Layers

                                        High density designs

                                        Max thickness 0.180”(4.5mm)

                                        Max panel size 24X42”(612X1070mm)

                                        Line/space to 3.0/3.0 mils (76um/76um, inner layers)

                                        Min core 1.0 mils (25.0um)

                                        Via in pad (POFV/VIPPO)

                                        0.2mm drill size

                                        0.5mm BGA

                                        Various structure types

                                        1.N+N;

                                        2.N+N+N;

                                        3.N+2+N

                                        Processes available:

                                        LDI (Laser Directing Image)

                                        8 camera post-etch punch

                                        CCD Back-drilling

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