Up to 64 layers

                                        Max thickness .374” (9.5 mm)

                                        Max panel size 24X48” (612x1219mm)

                                        M-Tg, Hi-Tg, low Dk/Df materials

                                        Press fit holes

                                        Controlled impedance

                                        Backdrilling Multiple depths, both sides

                                        BBlind vias, Dual Vias, Air via

                                        BBlind press-fit holes

                                        BCover PI-film on the surface

                                        BImmersion Tin or OSP or ENIG

                                        Reliability testing Thermal stress, IST, T-260

                                        Used as backbone of network switches/routers, servers and basestations